发明名称 SHORT-TIME HEAT TREATMENT DEVICE
摘要 PURPOSE:To heat a substrate uniformly and moreover having favorable efficiency, and to prevent the substrate from contamination by a method wherein the substrate of the member to be treated is heated in a floating condition. CONSTITUTION:A gas reservoir part 24 is formed inside of a pedestal 21 directly under the putting region 22 for the member to be treated, the gas reservoir part 24 thereof is connected to a gas source through a gas feed path 25, and one edge thereof is communicated to gas jet holes 26 of a large number of pieces opened to the putting region 22 for the member to be treated. The substrate 27 as the member to be treated is held in a floating condition according to gas jetted from the gas jet holes 26 using a short-time heat treatment device 30 constructed in such a way. Then, a shutter 23 is opened, and the temperature of the substrate is risen rapidly according to a heater 20 to perform short-time heat treatment. After heat treatment is finished, the shutter 23 is closed, gas feed is cut, the substrate 27 is put on the putting region 22 for the member to be treated, and the substrate 27 is taken out from the pedestal 21 to complete heat treatment.
申请公布号 JPS6045012(A) 申请公布日期 1985.03.11
申请号 JP19830153767 申请日期 1983.08.23
申请人 TOSHIBA KK 发明人 OKUMURA KATSUYA
分类号 H01L21/205;H01L21/18;H01L21/26;H01L21/31;H01L21/324 主分类号 H01L21/205
代理机构 代理人
主权项
地址