| 摘要 |
PURPOSE:To avoid destruction of input transistor when abnormal voltage is applied by making the resistance of at least one of lead wires 500OMEGA-10kOMEGA when an IC element is housed in a case wherein plural number of lead wires are provided and the IC is prepared by connecting bonding wires to plural number of pads. CONSTITUTION:An IC element 2 is fixed in a recessed portion formed at the center of the surface of a ceramic case 1 and plural number of bonding pads of the element 2 are connected to plural number of leads 4 provided in the middle stage of the case 1 using a bonding wire 3. Then, the lead 4 is connected to an external lead 5 for external connection and the element 2 is covered with a cap 7 which is fixed via the upper stage of the case 1 with sealing agent 6. In this construction, the lead 4 which is connected to the input terminal of an input transistor which constitutes the element 2 is made of metal nichrome of 500OMEGA- 10kOMEGA high resistance to have sufficient input protection capability. |
