发明名称 HIGH SPEED OPTICAL MODULATING MODULE
摘要 PROBLEM TO BE SOLVED: To provide an optical modulating module which can maintain a transmission reliability on the frequency of 2.5GHz and can reduce a matching resistance. SOLUTION: This high sped optical modulating module is made by a ceramic packaging a of lead frame 10 including an outer lead 12 and an inner lead 14 to which a high frequency signal is supplied, of a substrate 100 on which a metal base 60 with an impedance matching element containing a matching resistor 42 and a compensating capacitor 44 connected in parallel and a submount with a laser diode 28 are formed, of a first multiple bonding wire 46 which electrically connects the inner lead 14 of the lead frame 10 with a terminal of the impedance matching element, of a second multiple bonding wire 48 which electrically connects another terminal of the impedance matching element with a terminal of the metal base 60 and of a duplicate bonding wire 50 which electrically connects another terminal of the metal base 60 and the laser diode 28.
申请公布号 JPH10145007(A) 申请公布日期 1998.05.29
申请号 JP19970247309 申请日期 1997.09.11
申请人 SAMSUNG ELECTRON CO LTD 发明人 RI KAIEI;KIN SOBAI;KIN SEIICHI;BOKU KISHU
分类号 H01L25/00;H01S5/00;H01S5/022;H01S5/06;H01S5/062;H04B10/516;H04B10/61 主分类号 H01L25/00
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