| 摘要 |
PURPOSE:To enable to perform bonding by proper alignment of inner leads and outer leads by a method wherein the generation of positional slippage of the outer lead from the normal position of the inner lead is detected, which slippage is corrected automatically. CONSTITUTION:The position of a lead frame 30 is corrected by means of a detection camera 52. Meantime, a semiconductor device 17 on a film carrier 12 is transferred to a punching device 20, and thus being positioned to the punching mold of a die 21. Then, a bonding adsorption nozzle 51 lowers toward the die 21, and a punch 23 rises and punches the device 17. The nozzle 51 rises the device by adsorption-holding under vacuum pressure. Next, the X-Y table of a bonding head 50 is driven, and then the nozzle 51 moves to the bonding position and lowers again. The nozzle abuts against the lead frame 30 positioned normally, aligns the inner lead 17a of the device 17 to the outer lead 30a and keeps them. Heating proper is performed by means of a heating block 39, leading to bonding. |
