发明名称 METHOD FOR FORMING RELIEF PATTERN ON WOODEN MATERIAL
摘要 PURPOSE:To form a relief pattern which is not peeled off on the surface of a wooden material by such an arrangement wherein the surface of the material is covered with a forming mold having a female mold coinciding with a relief pattern and a liquid of resin which is set at normal temperatures is injected into a surrounded gap and the relief pattern of a specified shape is formed by causing the resin to harden, and at this time, part of the resin is caused to penetrate into small gaps between wooden fibers to hold the relief pattern securely. CONSTITUTION:The surface of a base board 10 is tightly covered with a forming mold 11. The mold 11 is formed by a rubber-like material such as silicon rubber, etc. and it has a female molding surface 12 coinciding with a relief pattern to be formed. A liquid of synthetic resin 22 is poured into a hopper 15 from a container 21. As synthetic resin material, a normal temperature setting resin such as polyurethane etc. is used. A relief pattern 30 is pasted integrally to the base board 10 by the resin penetrated into gaps 20.
申请公布号 JPS59222309(A) 申请公布日期 1984.12.14
申请号 JP19830098282 申请日期 1983.06.02
申请人 TOUSHIBA KOUGEI KK 发明人 YAMAZAKI TEI
分类号 B29C33/00;B29B7/00;B29B13/00;B29C33/10;B29C33/38;B29C33/44;B29C33/72;B29C37/00;B29C39/00;B29C39/10;B29C39/26;B29C39/42;B29C70/74;B29K101/10;B29L31/44;(IPC1-7):B29C6/00;B29C1/02 主分类号 B29C33/00
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