| 摘要 |
PURPOSE:To obtain the titled Cu alloy having superior heat resistance, electric and heat conductivities, bendability, adhesive strength to plating and solderability as well as sufficient strength by adding specified amounts of Ti, B, etc. to Cu as a base. CONSTITUTION:This Cu alloy for a lead frame consists of 0.05-0.4wt% Ti, 0.005-0.1wt% B and the balance Cu or further contains <=0.2wt% Sn. The alloy has superior strength, heat resistance and sufficient electric conductivity, and the bendability, adhesive strength to plating and solderability are satisfactory. The alloy is almost equal to a conventional Cu alloy in coefft. of thermal expansion, and it is suitable for use as the material of a lead frame for a semiconductor apparatus.
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