| 摘要 |
PURPOSE:The titled composition capable of forming a cured product free of a danger of corroding electric devices and appliances, prepared by using a catalyst component comprising an aluminum compound and a peroxysilyl group-containing silicon compound. CONSTITUTION:A photocurable epoxy resin composition is obtained by mixing an epoxy resin, e.g., bisphenol A-derived epoxy resin, with about 0.2-1.5 equivalent of an acid anhydride, e.g., phthalic anhydride, about 0.001-10wt% aluminum compound, e.g., trisacetylacetonatoaluminum, and about 0.1-29wt% peroxysilyl group-containing silicon compound, e.g., triphenyl(t-butylperoxy)silane.
|
