发明名称 Method for laser-welding thin wires and films
摘要 In order to weld thin wires on contact springs and films onto carriers, a platelet is placed onto the wire or the film, and the welding is subsequently carried out through this platelet. The welding takes place using a laser beam whose intensity and timing are metered. <IMAGE>
申请公布号 DE3307773(A1) 申请公布日期 1984.09.06
申请号 DE19833307773 申请日期 1983.03.04
申请人 SIEMENS AG 发明人 MUELLER,PAUL;PENZL,REINHOLD;RAISIG,HERRMANN
分类号 B23K26/20;H01R43/02;H05K3/32;H05K3/34 主分类号 B23K26/20
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