发明名称 |
Method for laser-welding thin wires and films |
摘要 |
In order to weld thin wires on contact springs and films onto carriers, a platelet is placed onto the wire or the film, and the welding is subsequently carried out through this platelet. The welding takes place using a laser beam whose intensity and timing are metered. <IMAGE> |
申请公布号 |
DE3307773(A1) |
申请公布日期 |
1984.09.06 |
申请号 |
DE19833307773 |
申请日期 |
1983.03.04 |
申请人 |
SIEMENS AG |
发明人 |
MUELLER,PAUL;PENZL,REINHOLD;RAISIG,HERRMANN |
分类号 |
B23K26/20;H01R43/02;H05K3/32;H05K3/34 |
主分类号 |
B23K26/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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