| 摘要 |
PURPOSE:To increase the strength of a bump part and reduce the quality dispersion by a method wherein an Al pad part is provided on an LSI element, the periphery is covered with a passivation film, a tri-metal part is adhered on the pad part, and coating is performed with solder to the tri-metal part, when a Cu plated part is provided thereon. CONSTITUTION:The Al pad part 2 is provided on the surface of the LSI element 1, its periphery is covered with the passivation film 3, a resist part 4 is interposed in the periphery of the surface of the film 3, the tri-metal part 5 is adhered over the entire surface including said part, and the center thereof is made to abut against the pad part 2. Next, the resist part 4 is likewise interposed in the periphery of the metal part 5, the Cu plated part 6 is adhered from the peripheral edge of said part to the metal part 5, and this exposed surface is covered with a Pb/Sn plated part 7. Thereafter, the resist part 4 is all removed together with the metal adhered thereon, this lacked part is filled with a Pb/Sn solder part 8, and the surface of a plated part 7 is also covered with the solder part 8. |
