| 摘要 |
PURPOSE:To improve a surge absorbing effect by incorporating a semiconductor laser element and a chip capacitor for absorbing a surge into the same package and connecting these element and capacitor in parallel. CONSTITUTION:A cap 5 as a package is set up to a system 7, in which each electrode of a semiconductor laser diode chip 1, a photodiode 2 for monitoring beams and a chip capacitor 3 for absorbing a surge is connected severally and mounted, to interrupt these parts from the outside air. A chip capacitor 14 for absorbing a surge is connected in parallel with a semiconductor laser diode 12. Accordingly, the leadless chip capacitor 3 is used for absorbing the surge, and the capacitor is incorporated into the same package as the semiconductor laser diode chip 1, thus eliminating an effect in high frequency by a lead wire, then improving a surge absorbing effect. |
