发明名称 RESISTOR COMPOSITE SUBSTRATE
摘要 <p>PURPOSE:To compound resistors of a large number in one substrate, and to enable to trim the whole resistors thereof by a method wherein conductors and the resistors of the plural number are formed inside of the laminated substrate, a part of the outside circumferential parts of the respective resistors and a part of the conductors are exposed on the same face of the surface of the substrate, and the other conductors are exposed on the other surface part. CONSTITUTION:An insulator sheet 22 having lead-out electrodes 21, an insulator sheet 28 having a resistor sheet 23 and a lead-out pattern 25 thereof, an insulator sheet 30 having a conductor pattern 29, and an insulator sheet 31 are arranged at the first-the fourth layers, and from the second layer to the fourth layer are arranged repeatedly. The respective sheets are stacked, lamination and baking are performed to obtain a sintered body having resistance circuits of four pieces, for example. Moreover, conductive materials 36 are put together by baking to decide the resistance values formed in the inside layers to a cut surface 33 having the resistor edge faces 34 and the conductor edge faces 35. Because the substrate obtained by this way has laminated structure, the number of circuits can be increased or decreased freely, and whole trimming can be performed easily.</p>
申请公布号 JPS59132643(A) 申请公布日期 1984.07.30
申请号 JP19830007880 申请日期 1983.01.20
申请人 NIPPON DENKI KK 发明人 IKEDA TERUYUKI;SHIMADA YUUZOU
分类号 H01C7/00;H01C17/06;H01L27/01;H05K3/46 主分类号 H01C7/00
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