发明名称 RESISTOR COMPOSITE SUBSTRATE
摘要 <p>PURPOSE:To compound resistors of a large number in one substrate, and to enable to trim wholly the resistors thereof by a method wherein conductors of the plural number are connected respectively to the different parts of the same conductor in the inside of the laminated substrate, and a part of each conductor is exposed on the surface part of the substrate. CONSTITUTION:An insulator sheet 22 having lead-out electrodes 21, an insulator sheet 28 having resistor parts formed by adhering with pressure a resistor sheet 23 as to be put on connecting electrodes 24 of the plural number enabling to obtain the desired trimming extent and the lead-out pattern 25 thereof, and an insulator sheet 29 are arranged at the first- the third layers, the second layer and the third layer are repeatedly arranged changing only the positions of through holes, and an insultor sheet 30 is arranged finally. The respective sheets are stacked, and lamination and baking are performed to obtain a sintered body having resistance circuits of three pieces, for example. Moreover, conductive materials 33 are put together by baking to decide the resistance values formed in the inside layers to terminals 32 according to the through holes mentioned above. Because this substrate has the laminated construction, the number of the circuits can be increased or decreased freely, and whole trimming can be performed easily.</p>
申请公布号 JPS59132642(A) 申请公布日期 1984.07.30
申请号 JP19830007879 申请日期 1983.01.20
申请人 NIPPON DENKI KK 发明人 IKEDA TERUYUKI;SHIMADA YUUZOU
分类号 H01C17/06;H01L27/01;H05K3/46 主分类号 H01C17/06
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