| 摘要 |
PURPOSE:To facilitate mount to a substrate and dismount therefrom by using semiconductor IC package consisting of a fixture having a film carrier and a package mounting means. CONSTITUTION:The semiconductor IC24 is fixed to the fixture 30 with die bond 25, and an insulation film 2 constituting the film carrier is fixed with adhesive 29. Leads 27 of the film carrier which are connected to the semiconductor IC24 pass outside the fixture and extend to the opposite side of the mounting position for the semiconductor IC, then becoming pads 28. Further, the fixture 30 has a fixed rod 31 whose tip is screw form on the surface opposite to the mounting position for the semiconductor IC. Then, the semiconductor IC package is fixed to a substrate by means of the fixed rod 31 passing through a hole 37 bored in the substrate, a check plate 34, and a clamping screw for the fixed rod. The pads 28 of the semiconductor IC package and the wiring pad 33 of the substrate are pressed by a projection 36 coming out of the fixture and then electrically connected. Since the semiconductor IC package and the substrate are only pressure-welded in this manner, mounting and dismounting are easy. |
