| 摘要 |
PURPOSE:To form a thick film integrated circuit of good heat dissipating effect by forming a thick film resistor on an electric insulation silicon carbide ceramic substrate via a glass film. CONSTITUTION:Using the electric insulation Si carbide ceramic substrate 1, the thick film conductor film 2 is formed on the substrate 1, and a semiconductor element 4 is connected to the thick film conductor film 2. The glass film 9 is formed on the substrate 1, and the thick film resistor 3 is formed on the glass film 9. Therefore, the heat dissipating effect becomes better because of a large thermal conductivity of the substrate 1. Besides, the thick film resistor 3 can be easily formed on the substrate 1. |
