发明名称 MULTI-SPINDLE COOLING DEVICE
摘要 PURPOSE:To cool main spindle devices effectively and evenly by a method wherein operating liquid is flowed through vapor pipes, liquid pipes and communicating pipes to transport the quantity of heat of bearings from the hollow chambers thereof to heat radiating devices. CONSTITUTION:The quantity of heat of the bearings 3, 31, which received the heat in bearing stands 4, 41, is deprived as the latent heat of evaporation when it heats the operating liquid, such as Flon or the like, in the hollow chambers 7, 71 and vaporizes it. The vapor of the vaporized Flon or the like moves to the heat radiating devices 8, 81 through the vapor pipes 10, 101 and is cooled by cooling fans 9, 91. The condensed operating liquid returns into the hollow chambers 7, 71 of the bearing stands 4, 41 through the liquid pipes 12, 121. A part of the vapor of the vapor pipe 10 inflows into the hollow chamber 71 of the bearing stand 41 through the communicating pipe 13, the heat radiating device 81 and the liquid pipe 121. On the other hand, a part of the vapor passing through the vapor pipe 101 inflows into the hollow chamber 7 of the bearing stand 4 through the communicating pipe 131, the heat radiating device 8 and the liquid pipe 12.
申请公布号 JPS59118348(A) 申请公布日期 1984.07.09
申请号 JP19820231728 申请日期 1982.12.24
申请人 MITSUBISHI DENKI KK 发明人 INOUE HITOSHI;KATAOKA KENJI;YAMAKAGE HISAAKI
分类号 B23Q11/12;F16C37/00 主分类号 B23Q11/12
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