| 摘要 |
PURPOSE:To improve the quality of a resin-sealed semiconductor device by coating by a spraying method fluorine polymer in the prescribed frame shape on the surface of a substrate to be associated of an IC element and completely preventing the flowout of the sealing resin. CONSTITUTION:Fluorine polymer which is diluted with organic solvent is injected from a nozzle 10 through a metal mask 11 on a substrate 1, on which the prescribed circuit pattern is formed to form a frame of hollow rectangular shape. Solvent is evaporated at ambient temperature. The polymer density is 2% or less, the thickness of the frame is 1mum or less, and the flowout of the sealing resin 5 and the collapse of the shape can yet be prevented by utilizing the surface tension effect of the fluorine. Then, an IC element 2 is secured with adhesive 7, and wired via wirings 4. The substrate 1 is maintained at approx. 200 deg.C on a hot plate, and epoxy resin is placed on the wirings of the element. Then, the resin is liquefied to spread to become almost thicknessless in shape, stopped at the inner edge of the polymer 9, and not flowed out, thereby reducing the manufacturing cost. |
