| 摘要 |
PURPOSE:To fast stick a top force and a bottom force severally to a lead section when the lead section is held by both forces, and to prevent the generation of a resin burr by forming a solder layer to the root section of the exposure prearranged section of resin material the lead section prior to the molding and coating of a principal section with a resin. CONSTITUTION:A lead section 2 is constituted by unifying a plurality of leads 21, 22, 23 by a frame section 4 and a tie bar 5, and the solder layer 6 is formed near the tie bar 5. A semiconductor element 7 is fixed to a substrate section 3 in the lead frame 1 while the electrode of the semiconductor element 7 and the leads 21, 23 are connected by metallic thin wires 8. The semiconductor structure is encased in a cavity section 11 constituted by the top force 9 and the bottom force 10, and the lead section 2 is held by the top force 9 and the bottom force 10. The resin material 12 is injected to the cavity section 11 under the state. The solder layer 6 is deformed easily by a holding by the top force 9 and the bottom force 10 on a resin molding, and the leads 21-23 and the forces are fast stuck. |
