| 摘要 |
PURPOSE:To lower the high electric resistance of an electrically conductive film and to enable high-speed plating by making the interval between cathode and anode small, the area of the anode small and the area of the cathode large. CONSTITUTION:A cathode panel 1 is suspended and fixed in a plating bath. A pair of anode panels 2 having a much smaller area than the cathode panel 1 are plated on both sides of the cathode panel 1 so that the interval between each of the anode panels 2 and the cathode panel 1 is made as small as possible. While the anode panels 2 are simultaneously moved back and forth with respect to a central-line of the panel 1, shown by the chain line, over a necessary distance, electroplating is carried out. |
