| 摘要 |
PURPOSE:To obtain the titled device with high resistance to heat and moisture, by sealing a light emitting element using a cured epoxy resin composition comprising an epoxy resin, an aluminum compound and an organosilicon compound having a non-substituted or substituted o-nitrobenzyloxy group directly bonded to a silicon atom. CONSTITUTION:A light emitting element is sealed by using a resin composition comprising a mixture of an alicyclic epoxy of an epoxy equivalent of 145, a bisphenol type epoxy of an epoxy equivalent of 900-1,000, tris(ethyl acetoacetonato) aluminum and diphenyldi(o-nitrobenzyloxy)silane. The mixture is heated, stirred and mixed for about 10min at 150 deg.C. In the resin composition thus obtained is immersed and light emitting element and, after picked up, light is radiated from a metal halide lamp for one min to photo-cure the composition. As a result, the composition is cured in a short time and the titled light emitting device with excellent characteristics is obtained. |
