发明名称 CERAMIC LEADLESS PACKAGE AND ITS MANUFACTURE
摘要 <p>PURPOSE:To execute molding, processing, metallizing printing and the printing of an insulating layer efficiently by printing a metallized wiring pattern and an external terminal to a gree ceramic sheet not baked and forming an external terminal section by a hot press. CONSTITUTION:A slurry-like ceramic raw material is flowed through a tape caster and a tape is molded, and the ceramic green sheet 1 is obtained. Through- holes 3 reaching one surface from the other surface are punched, and an inner surface is printed by using metallizing ink. A back pattern 6 is metallizing-printed, the sheet 1 is turned over and a surface pattern 7 is metallize-printed, and an insulating layer pattern 12 is formed so as to coat the intermediate section of a peripheral pattern 10. The sheet is molded by a press so that the surface is indented and the back is projected through heating and pressing, a snap groove is formed, the sheet is baked in a reducing atmosphere, and a metallic conductor layer not coated is plated.</p>
申请公布号 JPS5980946(A) 申请公布日期 1984.05.10
申请号 JP19820190945 申请日期 1982.10.30
申请人 NIHON GAISHI KK 发明人 ABE SHIYOUZOU
分类号 H01L23/12;H01L21/48;H01L23/04;H01L23/498;H05K3/34 主分类号 H01L23/12
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