| 摘要 |
PURPOSE:To obtain a containing device effective for preventing the electrostatic breakdown of a semiconductor device by forming a structure for eliminating the contact between the case and the leads of the device. CONSTITUTION:To contain semiconductors aligned in one row, conductive resin plates or metal plates added, for example, with carbon black or the like are bent along parallel lines to form a guided frame. A frame 3 of ?-shaped section for supporting a package body 1 for enclosing the body, and a frame 4 for enclosing the leads 2 without contact are used, and a terminal 5 is engaged with the shoulder of the body. The base side of the leads of the frame for enclosing the leads is formed in a slender neck part 6, and the end side 4 of the leads is formed widely. Thus, even if the ends of the leads 2 are slightly bent, the leads are not contacted with the case. A projection 7 is formed partly on the inner surface of the frame for mechanically supporting the package of the semiconductor device, and the contacting area of the case with the semiconductor body 1 is further reduced, thereby further increasing the antistatic effect. |
