| 摘要 |
PURPOSE:To provide a structural adhesive fixable with electrodeposition coatings without formation of pinholes, etc., by mixing epoxy resins, latent curing agents, liq. polyhydroxy compds. compatible with the epoxy resins, and conductive carbon black. CONSTITUTION:Epoxy resins such as bisphenol-type epoxy resins or urethane- modified epoxy resins, latent curing agents (e.g., a combination of dicyandiamide and imidazole), about 5-15wt% liq. polyhydroxy compds. compatible with said epoxy resins (e.g., polyether polyols, polyester polyols), and about 4-6wt% conductive carbon black (e.g., acetylene black, Ketjen black) are mixed to yield the intended structural adhesive. Said adhesive is well suited for use in bonding of door hemming of automobiles, etc. |
