| 摘要 |
PURPOSE:To shorten the time required for evaluating a wafer, and to improve workability and rationalize equipment investment by marking a defective chip by a signal from a memory storage by a marking device. CONSTITUTION:When starting the operation of a prober 30, a new wafer is moved onto a stage, the wafer is positioned, and a measurement start is commanded to a tester 31. When an acceptable chip or a defective one is decided through measurement, the result is transmitted over the memory storage 32 from the tester 31 and memorized in it, and a signal of a measurement end is transmitted over the prober 30 from the tester 31. A signal is transmitted over the prober 30 from the memory storage 32 according to the memorized result of measurement, the marking device 4 executes necessary marking in response to the signal, and the stage moves the wafer at every chip. When marking is all finished, the command of the measurement start is issued again, and said process is repeated. |
