| 摘要 |
Molding compsn. comprises (A) (1) 5-60 wt.% polyacrylate of formula CH2=CR1-CO-O ! -(R)-(O-CO-CR2=CH2)n, where R is OH free residue of an organic polyol contg. OH gps. bonded to different C; R1 and R2 are H or methyl; n is 1-3; (2) 5-60 wt.% monoethylenically unsatd. monomer soluble in (1), where (1)+(2) have viscosity 1-50 cps, and (3) 0.2-3 wt.% elevated temp. free radical caring catalyst. The compsn. further contains (B) 15-80 wt.% reinforcing fibers of m.p. or glass transition temp. above 130≦̸C. All wt.% are based on the total compsn. The fibers may be of glass, carbon or aromatic polyamide. The polyacrylate is e.g. ethoxylated bisphenol A dimethacrylate.
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