| 摘要 |
PURPOSE:To improve the strength of an Fe-Ni alloy used as an IC lead frame by employing the alloy which contains specific amount of specific metal. CONSTITUTION:An IC lead frame material contains 35-55% of Ni, 0.05% or less of C, 1.0% or less of Mn, further 0.05-3.0% of Si, Ti, Mo, Nb, Zr, W and the residue substantially of Fe. This alloy of such composition range is molten in vacuum by high frequency waves, then hot rolled, repeatedly annealed and cold rolled, and softened and annealed eventually at 800-1,100 deg.C in the step of rolling it into desired thickness. This plate is then pulverized into particles having 50mum or less of crystalline gain size, then cold worked at 10-25% of cold rolling rate, thereby providing characteristics having 210 or higher in Vicker's hardness Hv and 8 or more of bending number. |
