发明名称 PROBE CARD FOR TEST OF WAFER
摘要 PURPOSE:To enable to perform with certainty the transmission of an electric signal between a semiconductor and a test machine in an excellent accuracy by a method wherein a wafer sensing stand, consisting of transparent insulating material, and a wafer sensor having an electrode contact part, consisting of conductive material whereon a patterning is performed, are provided respectively. CONSTITUTION:As the width of the wiring part 13 of the wafer sensor 12 is formed narrower than the width of the conventional probe, the mounting density of the wafer sensor 12 can be increased, and the confirmation of the condition of contact between the electrode contact 13a of the wafer 1 and the electrode 1b of a semiconductor element 1a can also be performed easily using a stereoscopic microscope, because a transparent insulating material is used for the wafer sensor stand 2. Besides, the arrangement constitution of the electrode contact part 13a and the electrode 1b can always be constituted in coincidence with each other by performing a patterning on the electrode contact part 13a of the wafer sensor 12 using the glass mask which is used when the electrode 1b of the semiconductor element 1a is formed, thereby enabling to form the electrode contact part 13a and the electrode 1b in coincided arrangement constitution and also to form the electrode contact part 13a based on said manufacturing technique even when the number of electrode 1b is increased, because the electrode 1b can be formed as above.
申请公布号 JPS5911640(A) 申请公布日期 1984.01.21
申请号 JP19820122501 申请日期 1982.07.12
申请人 MITSUBISHI DENKI KK 发明人 TADA TETSUO;NISHIMURA YASUMASA
分类号 G01R1/073;H01L21/66;(IPC1-7):01L21/66 主分类号 G01R1/073
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