| 摘要 |
PURPOSE:To solder uniformly the work having long soldering parts in a short time at a good yield by sticking solder to the part to be soldered of the work with a solder jet continuously at the varying jet height and utilizing the vertical movement of the solder jet in soldering said part. CONSTITUTION:Molten solder 3 is jetted by the high speed revolution of a motor 9 and the peak point of the jet is built up to the height position shown in the figure (a). The leads 6, which extend downward, among 4 groups of the leads extending from the body 7 of a semiconductor device (work) 5 are dipped in this state into the solder 3 down to the neck of the body 7. The running of the motor 9 is thereafter changed to a low speed upon lapse of a specified time to make the peak point of the jet lower as shown in the figure (b) so that the leads 6 extending downward are removed from the solder 3. The height of the jet is decreased at the lower speed in this stage than in the stage of increasing the same. The work 5 is then rotated 90 deg. by a support mechanism 11 to direct the unsoldered lead groups downward. The motor 9 is run again at a high speed to dip the leads 6 into the solder 3 and the solder the same and again the running of the motor is decreased to a low speed; thereafter, the solder is stuck successively on the whole of 4 groups of the leads 6. |
