| 发明名称 |
Conductive metallization of substrates via developing agents. |
| 摘要 |
<p>A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.</p> |
| 申请公布号 |
EP0297677(A1) |
申请公布日期 |
1989.01.04 |
| 申请号 |
EP19880201342 |
申请日期 |
1988.06.29 |
| 申请人 |
AKZO N.V. |
发明人 |
PARR, WILLIAM JOHN E;HUTTON, RONALD ERIC;MOY, PAUL YUET YEE;FRANK, DIETER;STRAWSER, DAVID A. |
| 分类号 |
B22F7/04;B32B15/08;C23C4/18;C23C24/06;C23C24/08;H01B1/22;H01B13/00;H05K3/02;H05K3/10;H05K3/14;H05K3/20;H05K3/24;(IPC1-7):C23C24/08 |
主分类号 |
B22F7/04 |
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