| 摘要 |
PURPOSE:To contrive to enhance the heat dissipation effect and reliability of the semiconductor device by a method wherein a cap is made to come in contact with the backs of semiconductor elements, and a elastic body is interposed between a housing frame fixed to a substrate and the parts of the cap facing with the backs of the elements to press the cap to the backs of the elements. CONSTITUTION:A flange 9 manufactured of Kovar is soldered 5 to the whole circumference of the substrate 2, and the whole circumference of the copper foil cap 11 having temperately elastic plasiticity is soldered 10 to the flange 9. The cap comes in contact with the backs 1b of the elements 1. Fin blocks 12a are soldered 14 on the cap 11 corresponding to the faces 1b. The housing frame 13 is fixed to the flange 9 to surround heat radiators 12, and is made ventilatably. Springs 15 are provided between the frame 13 and the fin blocks 12a, and the four corners are pressed independently to make the cap 11 and the faces 1b to be adhered closely. According to this construction, developed heat of the elements is radiated favorably through the fins 12, and because distortion according to the difference of thermal expansions of the cap and the substrate is absorbed by slips of the backs of the elements and by deformation of the springs, application shearing stress to salient electrodes 4 is avioded, and reliability is enhanced. |
