| 摘要 |
PURPOSE:To simply mount an IC by fully inserting the connecting terminals of the IC into the hole of a printed board, holding the root of the terminal above the upper surface of the substrate and soldering a conductor foil with the lower surface of the substrate. CONSTITUTION:The part (c) of an IC 5 is longer than a hole (a) formed at a printed board, and the width of the hole is formed in size capable of just inserting the terminal 6 of the IC. When the all terminals 6 of the IC 5 are inserted into the hole (a), the IC is supported at the part (c) to the substrate 1, the root of the terminal 6 is disposed above the surface of the substrate 1, the terminal 6 is contacted with the conductor foil 10 on the back surface of the substrate without displacement. According to the configuration, it is dipped in solder. Then, the damage of the IC due to heat can be effectively prevented, and even if the interval of the IC terminals is narrow, the possibility of shortcircuit therebetween can be extremely reduced. |
