| 摘要 |
PURPOSE:To attain miniaturization of a camera for high temperature environment, by providing a heat absorbing section of an electronic refrigeration element for an imge pickup element and a heat dissipating section in contact with a camera case. CONSTITUTION:An image pickup tube 3 is contained in the camera case 1. The pickup tube 3 is provided with a coil assembly 2 and the heat absorbing section 102 of the electronic refrigeration element 100 is placed around a photoelectric converting plane 31 so as to be in contact with the coil assembly 2. The heat dissipating section 103 of the electronic refrigeration element 100 is contacted with the camera case 1 via a heat conductor 5, and a light from a lens 6 is image formed on the photoelectic converting plane of the pickup tube 3. Since a large cooling mechanism is not required, the camera device for high temperature environment is miniaturized. |
