METHOD OF PRODUCING FLEXIBLE CIRCUIT BOARD

摘要

An aromatic imide polymer laminate material usable as a flexible circuit board substrate is produced by the process comprising coating a surface of a metallic foil with a solution of an aromatic imide polymer comprising at least 90 molar % of recurring unit of the formula (I): (I) wherein R is a symmetrical bivalent aromatic radical having no substituent, and dissolved in a solvent consisting essentially of at least one phenolic compound; and heat drying the resultant solution layer to form an aromatic imide polymer solid layer firmly bonded directly to the metallic foil.