| 摘要 |
<p>PURPOSE:To increase the net working rate of high cost equipment by shortening the retention time of molding in a metal mold, by a method wherein the plastic material injected into the molding apparatus is heated in the metal mold for a short time and thereafter is transoferred into a heating furnace installed near said apparatus, being curred by heating. CONSTITUTION:The plastic material injected into a molding apparatus is retained within metal molds 11 and 11A until said plastic material is cured without deformation (generally, 10-20sec), and said plastic material is transferred into a heating furnace 16 heated at the same temperature as that of metal molds 11 and 11A installed near the molding apparatus, being completely cured, and the plastic mold is obtained. EFFECT:The increase of manufacture yield of semiconductor IC, etc. is possible.</p> |
