| 发明名称 |
ATTACHMENT OF SOLDER PREFORM TO A COVER FOR A SEALED CONTAINER |
| 摘要 |
<p>A method is described for attaching a preformed solder ring to a cover used to hermetically seal a container for a semiconductor device. The surface of the preformed solder ring that engages the cover is caused to melt and bond to the cover on solidification while the opposite surface of the ring is maintained relatively cool in a solid state by abutment against the flat surface of a cooling block.</p> |
| 申请公布号 |
CA1151011(A) |
申请公布日期 |
1983.08.02 |
| 申请号 |
CA19810377200 |
申请日期 |
1981.05.08 |
| 申请人 |
COMINCO LTD. |
发明人 |
LIANG, SHOU C. |
| 分类号 |
B23K3/04;B23K3/06;B23K35/02;H01L21/50;H01L21/52;(IPC1-7):B23K1/14 |
主分类号 |
B23K3/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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