| 摘要 |
PURPOSE:To improve the airtightness of a package, by bringing into contact a ceramic substrate with a transparent substrate at the inside of the sealed area, and sealing the outer side part with soldering. CONSTITUTION:A frame-shaped ceramic matter 1a having a smaller external form than a ceramic substrate 1 and equal internal form is laminated at the area close to the side of a cavity formed on the sealing surface where the upper face of the substrate 1 is in contact with a transparent plane 2. The special solder 17 is put between the substrate 1 and the transparent flat plate 2 at the outer circumference part of the ceramic frame 1a. The solder 17 is then fused by the ultrasonic wave energy and hardened. Thus the airtight sealing is secured between the substrate 1 and the plate 2. The solder 17 can be prevented from scattering to the cavity part during a sealing process. |
