发明名称 Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
摘要 <p>A card (10) comprises three layers of plastic consisting of a central core (12) itself formed from three layers (12A,12B,12C). The core is coated with upper (13) and lower (14) transparent layers. An opening (15) in one corner of the card, which is least subjected to mechanical movement, comprises two coaxial circular cavities (15A,15B) of different dias. This opening houses an integrated circuit (16) mounted inside a window on a flexible film support. The support carries metallic contact pads (11) which are connected to the circuit by connections (18) in the opening. These are surrounded by a protective and electrically insulating material (20). The latter provides mechanical damping during manufacture and use of the card. Small openings (21) in the upper layer over the metallic contact pads allows access to stored data.</p>
申请公布号 FR2520541(A1) 申请公布日期 1983.07.29
申请号 FR19820000956 申请日期 1982.01.22
申请人 FLONIC SA 发明人 ROLAND ALLESCH, ANDREE GIRARD, RENE ROSE ET ALAIN ZARUDIANSKY
分类号 G06K19/077;H01L21/56;H01L21/58;H01L21/60;H01L23/14;H01L23/31;H01L23/498;(IPC1-7):11B5/80;06K19/04 主分类号 G06K19/077
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