| 摘要 |
PURPOSE:To remove defective bonding by providng a grasping section in the hand for grasping a chip used for die bonding with an instrument measuring the reflectivity of a package surface. CONSTITUTION:The tip sections of optical fibers 8a, 8b are fitted onto the surface of chip bonding of a package at approximately right angles in hand sections 7a, 7b for grasping the chip. When gold strips are melted by the progress of die bonding and a condition in which the gold strips spread over an adhesive surface is brought, the optical fibers 8a, 8b detect the change of the reflectivity of the bonding surface due to the melting of the gold strips. The completion of bonding is determined by detecting the change of the reflectivity. That is, reflected light from the die bonding surface is converted into voltage through reflectivity measuring circuits 11a, 11b, and transmitted to a comparison circuit 12. The reflectivity changes and voltage from the reflectivity measuring circuits rises when gold is melted, and the comparator is operated and the bringing of gold-silicon to a eutectic state is detected when the voltage exceeds the reference voltage. The AND of signals from the two fibers 8a, 8b is taken by an AND circuit 12d and the completion of bonding is detected. |
