| 摘要 |
PURPOSE:To prevent the sagging down of a surface copper layer at the cutting part of a dumet wire when it is welded, in the slug lead which is formed by welding one end part of the dumet wire and one end part of a lead wire, by performing an area decreasing machining of the dumet wire at a specifiedd rate or less before the welding. CONSTITUTION:In order to obtain one raw material having a diameter of D= 0.8mm., which constitutes the slug lead A, the raw dumet wire of 0.8-0.84mm.phi is used. The surface reducing machining of 10% or less is performed by a low angle die whose angle is 2 deg.-6 deg.. In order to obtain the slug lead A, the dumet wire 1, whose surface reducting has finished, is cut as a stud. Even though the dumet wire 1 is welded to the lead wire 2, since the surface copper layer of the dumet wire is hardened by the surface reducing machining, a cut diameter ratio alpha/D becomes 99% or more, and the slant of a semiconductor element 3 and the cracks of sealing glass due to the sagging down of the cut part can be prevented. |
