发明名称 BOILING AND COOLING DEVICE
摘要 PURPOSE:To enhance the heat radiating effect at the bottom of a vessel, by reducing the lower part sectional area of a descent flow path more than the upper part one thereof. CONSTITUTION:The sectional area S of the flow path 8, formed between flow adjusting plates 7 and the vessel 3, gradually becomes smaller as it goes to the lower part of the vessel 3, and the length H is small. In such a manner, the flow speed of the coolant 2 flowing through the flow path 3 of the vessel 8 becomes higher as it goes in the lower part, and accordingly the thermal conductivity is increased. Besides, the stagnation of the coolant 2 at the bottom of the vessel 3 becomes small. This fact is extremely effective, in case of e.g. the installation of a boiling and cooling device on the floor of an electric car, etc., particularly because the bottom of the vessel 3 is contributed to heat radiation.
申请公布号 JPS58108759(A) 申请公布日期 1983.06.28
申请号 JP19810208648 申请日期 1981.12.22
申请人 MITSUBISHI DENKI KK 发明人 NAKAO KAZUNARI;FUJII MASAO;TETSUNO HARUO
分类号 H01L23/44;F25B23/00;F28F13/06;H01L23/427 主分类号 H01L23/44
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