| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of reducing reliability, because deformation of a printed wiring board of a first layer sandwiched between upper and lower electrode terminals in a stacked semiconductor package caused by temperature fluctuation is restrained by the upper and lower electrode terminals, thus making it impossible to relieve strain and a stress is concentrated on a certain particular electrode terminal. SOLUTION: The present invention provides a stacked semiconductor package, with a first electrode terminal formed in a semiconductor package of a first layer and a second electrode terminal formed in a semiconductor package of a second layer having the same pitch size, wherein the first and second electrode terminals are arranged planarly so as not to be overlapped on each other in X and Y directions. Thus, stress concentration on the electrode terminal is relieved, to improve connection reliability under temperature fluctuation. COPYRIGHT: (C)2008,JPO&INPIT
|
