| 摘要 |
PURPOSE:To enhance precision of recognition of the position, to contrive to miniaturize a printed pattern to be formed on a ceramic substrate, and to contrive to highly integrate a hybrid IC by employing recognition marks. CONSTITUTION:Before a first pattern 3 is to be formed using a metal of silver system on the main surface of the white ceramic substrate 1, a black second pattern 2 consisting of a resistor material is provided on the main surface of the ceramic substrate, and when the first pattern is to be formed, the first pattern is stacked partially on the second pattern using a mask for formation of the first pattern to provide the recognition marks 8. When a semiconductor element 4 is to be fixed, the black recognition marks 8 are detected automatically according to the optical method to recognize precisely the mounting part 5, and the element is fixed on the mounting part 5. Moreover when wire bonding is to be performed, the two recognition marks 8 and electrodes 9 of the semiconductor element 4 are detected, positional relation of the semiconductor element 4 and wiring layers 6 is recognized, and the respective electrodes 9 of the semiconductor element 4 and the wiring layer parts corresponding thereto are connected automatically with aluminum wires 10 through the ultrasonic bonding method. |
