| 摘要 |
PURPOSE:To manufacture electronic component parts with good external size accuracy and less air bubbles by a method wherein, when inserting electronic part elements into liquid resin with a jig, a jig with good separatability is brought into close contact against the free surface of the liquid resin and then removed after hardening. CONSTITUTION:A predetermined amount of liquid resin 4 is poured in the recess of a metal-made case 1. A preassembly including a semiconductor element 3 disposed at the ends of leading-out conductors 2a, 2b is set on a jig 5, and this assembly is slowly inserted into the liquid resin 4. At this time, by abutting the jig 5 against the edge of an opening of the case 1, the leading-out conductors 2a, 2b and the semiconductor element 3 are positioned properly. Then, after hardening the liquid resin 4, the jig 5 is removed. When the resin 4 is pushed by the jig 5, the surplus resin rises up through gaps in the jig 5. With an amount of resin being adjusted, an amount of the rising is made small and the resin 4 hardly adheres onto the surroundings of the leading-out conductors 2a, 2b. Also, since the free surface is pushed, air bubbles in the resin are eliminated and the resin enters all minute spaces so as to coat and enclose the semiconductor element 3 positively. |
