| 摘要 |
<p>A single level packaging arrangement and connector for large or very large scale integrated circuit chips is disclosed. This arrangement utilizes dual function optical transducers and fiber optic cables as the transmission medium by which most, if not all, chip I/O communication is effected. The top portion of the connector acts as a conductive collar which serves as both a heat sink and a shield against stray external signals. A chip site is formed in the top portion of the connector and the chip removably lodged therein. The top portion of the connector also includes connector pads which are utilized to make solderless connection to deformable chip pads and to dual purpose optical transducers. Thermal grease, which is forced into and fills site cavities provided for that purpose, assists in conducting heat from within the connector to thereby enhance the heat dissipation characteristics of the chip site. The chip itself is retained in the site by the use of wedges and retaining strips secured to the connector at appropriate locations therein. The bottom portion of the connector is provided with a first group of holes that house the optical transducers in operative alignment with the bottoms of predetermined ones of the site connector pins. A second group of holes in the bottom portion includes the optical cables that couple the chip's I/O pads to selected circuits and/or devices. The top and bottom connector portions are joined together by suitable means.</p> |
