DEVICE FOR INSERTING IC TO PRINTED BOARD,申请号JP19810175514-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	DEVICE FOR INSERTING IC TO PRINTED BOARD
摘要
申请公布号	JPS5877288(A)	申请公布日期	1983.05.10
申请号	JP19810175514	申请日期	1981.10.31
申请人	TAKAHASHI KAZUO	发明人	TAKAHASHI KAZUO
分类号	H05K13/04;H05K3/30	主分类号	H05K13/04
代理机构		代理人
主权项
地址

您可能感兴趣的专利

METHOD AND DEVICE FOR THE DIRECT DIGITIZATION OF MICROWAVE SIGNALS

METHOD OF DETECTION BY ENHANCEMENT OF SILVER STAINING

ANTIGEN PANELS AND METHODS OF USING THE SAME

ADHESIVELY BONDED, LEAK-PROOF SHELF

MODULATION OF TYPE IIbeta PHOSPHOINOSITIDE PHOSPHATE KINASE

TRANSMUCOSAL DELIVERY OF PROTON PUMP INHIBITORS

ENDOTHELIAZATION OF VASCULAR SURFACES BACKGROUND OF THE INVENTION

LOW FREQUENCY INVERTER FED BY A HIGH FREQUENCY AC CURRENT SOURCE

RESORPTION-CONTROLLED BONE IMPLANTS

ENDOSCOPIC SYSTEM WITH A SOLID-STATE LIGHT SOURCE

RESOURCE MANAGEMENT FOR THE CO-ORDINATED DYNAMIC ADAPTATION OF THE QUALITY OF SERVICE OF IP-BASED NETWORK SERVICES

DISPOSABLE ABSORBENT ARTICLE MULTIPLE DIRECTIONAL SIDE PANELS

CIRCUIT FOR CANCELING THERMAL HYSTERESIS IN A CURRENT SWITCH

SYSTEM AND METHOD FOR DISTRIBUTING DATA BETWEEN A TELEPHONE NETWORK AND AN ENTERTAINMENT NETWORK

METHODS AND APPARATUS FOR RECONFIGURABLE WDM LIGHTPATH RINGS

SEAT BELT SHIFTER LOCK SYSTEM

SUN FOLLOWING METHOD IN SOLAR SYSTEM

INDUCTIVE DEVICE

Wafer bonding for three-dimensional (3D) integration