| 摘要 |
<p>PURPOSE:To reduce the shrinkage of a resin film and to prevent exfoliation and cracks, by applying, for coating, a substance prepared by mixing insulating particles formed of metal oxide, metal nitride or the like, as a filler, in a high molecular material. CONSTITUTION:A high molecular material in which insulating inorganic particles of metal oxide or metal nitride or the like are mixed as a filler is formed into a film on the surface of an electronic parts. As the insulating inorganic particles, metal oxide such as SiO2, Al2O3, TiO2, Ta2O5 and ZnO2, metal nitride such as Si3N4, or Si is used, while, as insulating resin, polyimide, polyamidoimide, phenolic resin, silicon resin, polycarbonate resin, polybenzimidazole resin, polyparabanic acid resin or the like is used.</p> |
