A steam sealing strip for closing open edges between opposed upper and lower cooperating wafer baking plates includes an upper sealing strip portion for coupling with the upper baking plate and a lower sealing strip portion for coupling with the lower baking plate. The baking plates define therebetween a primary wafer baking space for the baking of dough. The upper and lower sealing strip portions provide secondary baking surfaces disposed in opposed, spaced, face-to-face relationship. These secondary baking surfaces define a secondary baking space for baking excess dough which flows from between the baking plates during the baking of wafers. By baking this excess dough, the formation of unbaked dough portions or unbaked dough balls is prevented. The sealing strip includes a plurality of steam channels for releasing steam from between the baking plates. These steam channels open into the secondary baking space.
