发明名称 COLD CURING COMPOSITION
摘要 PURPOSE:To provide the titled composition having excellent autohesive properties, by compounding a polymer having a main chain composed of a polyether and having hydrolyzale and crosslinkable silicon group, a silicone-modified epoxy resin, and a curing catalyst, at specfic ratios. CONSTITUTION:The objective composition is prepared by mixing and kneading (A) 100pts.wt. of a polymer having a main chain composed essentially of a polyether (such as polyoxypropylene having a molecular weight of preferably 300-20,00) and having hydrolyzable and crosslinkable silicon group (e.g. silyl group bonded with alkoxy group, etc.) at the chain terminals, (B) 0.01-20pts.wt. of a silicone-modified epoxy resin (a product obtained by the reaction of a compound having two or more epoxy functional groups in the molecule with a silicone compound having a functional group reactive with epoxy group), (C) 0- 10pts.wt. of a curing catalyst (e.g. tin octylate), and if necessary (D) a filler, etc. USE:The composition is useful as an elastic sealant, paint, adhesive, etc. for the bonding of glass, metal, stone, especially mortar, etc.
申请公布号 JPS582326(A) 申请公布日期 1983.01.07
申请号 JP19810101755 申请日期 1981.06.29
申请人 KANEGAFUCHI KAGAKU KOGYO KK 发明人 HIROSE TOSHIBUMI;TAKAMATSU OSAMU;FUJIMOTO KAZUHIDE;ISAYAMA KATSUHIKO
分类号 C09K3/10;C08G65/32;C08K5/57;C08L71/00;C08L71/02;C08L87/00;C09D5/00;C09D171/00;C09J161/20;C09J171/00 主分类号 C09K3/10
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