发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device wherein a coating film which is made of a polyimide resin or a polyimide isoindoloquinazolinedione resin and which is at least 10 mu m thick is disposed on at least an active region of a semiconductor substrate, and the resultant semiconductor substrate is encapsulated in a ceramic package. The semiconductor device has troubles relieved conspicuously, the troubles being ascribable to alpha-rays which come flying from impurities contained in the material of the package.
申请公布号 GB2036428(B) 申请公布日期 1983.01.06
申请号 GB19790039889 申请日期 1979.11.19
申请人 HITACHI LTD 发明人
分类号 H01L23/32;H01L21/312;H01L23/057;H01L23/10;H01L23/29;H01L23/31;H01L23/556 主分类号 H01L23/32
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