Method and semiconductor wafer for determining the local distribution of substrate contact resistance in a semiconductor wafer and use of the semiconductor wafer for measurement purposes

摘要

The invention relates to a method and a system for determining the local distribution of the substrate contact resistance between semiconductor wafer (13) and metallisation (14) encountered in the case of semiconductor wafers (13) provided with a metallisation (14) on at least one side. On the side opposite the metallisation (14), the semiconductor wafers (13) to be measured are provided with a plurality of test doping structures (1) which are limited in area and to which contact is made in each case by a voltage conductor track (4) and a current conductor track (8) which is spatially separated from the voltage conductor track (4). With current flowing between current conductor track (8) and metallisation (14), the voltage present between voltage conductor track (4) and metallisation (14) and the current flowing between current conductor track (8) and metallisation (14) are determined for each test doping structure (1). <IMAGE>