发明名称 METHOD OF PROVIDING ELECTRIC INSULATING MEDIUM BETWEEN APERIN OF SUPERIMPOSED MEMBERS
摘要 PURPOSE: To reduce the dielectric constants between a base member and a cap member and between supporting members by forming low-pressure spaces between the base and cap members and around the supporting member by removing a removable material through access openings. CONSTITUTION: A plurality of supporting members 12 extended upward is formed and a removable material 14 is stuck to the upper surface of the member 10 and to the periphery of the supporting members (metallic wires) 12. Then a cap member 16 made of an insulating material is stuck to the members 12 and material 14. After the member 16 is stuck to the members 12 and material 14, access openings 19 are formed through at least one of the base member 10 communicated with the material 14 and cap member 16 and the material 14 is removed through the openings 19. Consequently, spaces are formed between the cap member 16 and the base member 10 and between supporting members 12. Then a low-pressure enclosed space is formed between the members 16 and 10 by filling up the openings 19. Therefore, the dielectric constants between the base 10 and cap 16 and between the metallic wires 12 can be reduced.
申请公布号 JPH02218150(A) 申请公布日期 1990.08.30
申请号 JP19890324166 申请日期 1989.12.15
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 SUTANREI ROBAATSU;KAATAA UERINGU KANTA
分类号 H01L21/768;H01L23/522 主分类号 H01L21/768
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